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| BUZ 339 SIPMOS (R) Power Transistor * N channel * Enhancement mode * Avalanche-rated Pin 1 G Pin 2 D Pin 3 S Type BUZ 339 VDS 500 V ID 11.5 A RDS(on) 0.5 Package TO-218 AA Ordering Code C67078-S3133-A2 Maximum Ratings Parameter Continuous drain current Symbol Values 11.5 Unit A ID IDpuls 46 TC = 33 C Pulsed drain current TC = 25 C Avalanche current,limited by Tjmax Avalanche energy,periodic limited by Tjmax Avalanche energy, single pulse IAR EAR EAS 11.5 16 mJ ID = 11.5 A, VDD = 50 V, RGS = 25 L = 10.8 mH, Tj = 25 C Gate source voltage Power dissipation 790 VGS Ptot 20 170 V W TC = 25 C Operating temperature Storage temperature Thermal resistance, chip case Thermal resistance, chip to ambient DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Semiconductor Group Tj Tstg RthJC RthJA -55 ... + 150 -55 ... + 150 0.74 75 E 55 / 150 / 56 C K/W 1 07/96 BUZ 339 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 500 3 0.1 10 10 0.4 4 V VGS = 0 V, ID = 0.25 mA, Tj = 25 C Gate threshold voltage VGS(th) 2.1 VGS=VDS, ID = 1 mA Zero gate voltage drain current IDSS 1 100 A VDS = 500 V, VGS = 0 V, Tj = 25 C VDS = 500 V, VGS = 0 V, Tj = 125 C Gate-source leakage current IGSS 100 nA 0.5 VGS = 20 V, VDS = 0 V Drain-Source on-resistance RDS(on) VGS = 10 V, ID = 7.5 A Semiconductor Group 2 07/96 BUZ 339 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit gfs 8 14 2200 260 100 - S pF 3000 400 150 ns 35 50 VDS 2 * ID * RDS(on)max, ID = 7.5 A Input capacitance Ciss Coss - VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance Crss - VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time td(on) VDD = 30 V, VGS = 10 V, ID = 2.9 A RGS = 50 Rise time tr 70 100 VDD = 30 V, VGS = 10 V, ID = 2.9 A RGS = 50 Turn-off delay time td(off) 450 680 VDD = 30 V, VGS = 10 V, ID = 2.9 A RGS = 50 Fall time tf 110 160 VDD = 30 V, VGS = 10 V, ID = 2.9 A RGS = 50 Semiconductor Group 3 07/96 BUZ 339 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TC = 25 C Inverse diode direct current,pulsed A 1.1 450 7.6 11.5 46 V 1.5 ns C Values typ. max. Unit ISM VSD trr Qrr TC = 25 C Inverse diode forward voltage VGS = 0 V, IF = 23 A Reverse recovery time VR = 100 V, IF=lS, diF/dt = 100 A/s Reverse recovery charge VR = 100 V, IF=lS, diF/dt = 100 A/s Semiconductor Group 4 07/96 BUZ 339 Power dissipation Ptot = (TC) Drain current ID = (TC) parameter: VGS 10 V 12 A 180 W 10 Ptot 140 120 100 ID 9 8 7 6 80 60 40 5 4 3 2 20 0 0 1 0 20 40 60 80 100 120 C 160 0 20 40 60 80 100 120 C 160 TC TC Safe operating area ID = (VDS) parameter: D = 0.01, TC = 25C 10 2 t = 1.4s p Transient thermal impedance Zth JC = (tp) parameter: D = tp / T 10 0 A 10 s K/W ID 100 s ZthJC 10 1 DS (o n) /I D =V DS 10 -1 1 ms R 10 ms D = 0.50 0.20 10 0 10 -2 0.10 0.05 single pulse 0.02 0.01 DC 10 -1 0 10 10 1 10 2 V 10 3 10 -3 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 s 10 0 VDS tp Semiconductor Group 5 07/96 BUZ 339 Typ. output characteristics ID = (VDS) parameter: tp = 80 s l Typ. drain-source on-resistance RDS (on) = (ID) parameter: VGS 1.6 26 A 22 Ptot = 170W k jg hf i e d VGS [V] a 4.0 b c 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 a b RDS (on) 1.2 ID 20 18 c d e f g 16 14 12 10 8 6 4 2 0 0 a b 1.0 0.8 c h i j 0.6 e d f gh ji k 10.0 l 20.0 0.4 0.2 VGS [V] = a 4.0 4.5 b 5.0 c 5.5 d 6.0 e f 6.5 7.0 g 7.5 k h i j k 8.0 9.0 10.0 20.0 0.0 4 8 12 16 20 24 V 30 0 2 4 6 8 10 12 14 16 A 19 VDS ID Typ. transfer characteristics ID = f (VGS) Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s VDS2 x ID x RDS(on)max 13 A 11 parameter: tp = 80 s, VDS2 x ID x RDS(on)max 16 S ID 10 9 8 7 gfs 12 10 8 6 5 4 3 2 1 0 0 0 1 2 3 4 5 6 7 8 V 10 0 2 4 6 8 A ID 12 4 6 2 VGS Semiconductor Group 6 07/96 BUZ 339 Drain-source on-resistance RDS (on) = (Tj ) parameter: ID = 7.5 A, VGS = 10 V 2.2 Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 1 mA 4.6 V 4.0 RDS (on) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -60 -20 20 60 100 C 160 98% VGS(th) 3.6 3.2 2.8 2.4 2.0 typ 2% 98% typ 1.6 1.2 0.8 0.4 0.0 -60 -20 20 60 100 C 160 Tj Tj Typ. capacitances C = f (VDS) parameter:VGS = 0V, f = 1MHz 10 1 Forward characteristics of reverse diode IF = (VSD) parameter: Tj , tp = 80 s 10 2 nF C 10 0 A Ciss IF 10 1 Coss 10 -1 Crss 10 0 Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%) 10 -2 0 5 10 15 20 25 30 V VDS 40 10 -1 0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD Semiconductor Group 7 07/96 BUZ 339 Avalanche energy EAS = (Tj ) parameter: ID = 11.5 A, VDD = 50 V RGS = 25 , L = 10.8 mH 800 Typ. gate charge VGS = (QGate) parameter: ID puls = 17 A 16 mJ V EAS 600 VGS 12 500 10 0,2 VDS max 0,8 VDS max 400 8 300 6 200 4 100 0 20 2 0 40 60 80 100 120 C 160 0 20 40 60 80 100 120 140 nC 170 Tj Q Gate Drain-source breakdown voltage V(BR)DSS = (Tj ) 600 V 580 V(BR)DSS 570 560 550 540 530 520 510 500 490 480 470 460 450 -60 -20 20 60 100 C 160 Tj Semiconductor Group 8 07/96 BUZ 339 Package Outlines TO-218 AA Dimension in mm Semiconductor Group 9 07/96 |
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